- Bonding Speed:
- Bonding Accuracy:
- Maximum lead frame width:
- 38ms/wire
- ±2μm
- 100mm
Wire Bonder ROCKET PLUS 100
Wire Bonder ROCKET PLUS 100 is a high-speed automatic wire bonder developed by Guangdong Guangdong ADA Semiconductor Equipment Ltd. It uses thermal ultrasonic ball welding and wedge welding processes to conduct wire bonding on semiconductor devices by heating, pressurization and ultrasonic energy.
Material
Used for IC packaging, SOP、SOT、QFP、 DFN、 DIP、QFN、 BGA etc.
Performance
1. Dual frequency transducer，Frequency can switch between 1st bond or 2nd bond for better bondability of sensitive chips
2. Piezo-wire clamp, fast response and consistent looping
3. Optional dual path optics and auto-focus optics, for multiple die with different die height and stack die
4. Hot/cold air for bond head temperature control to ensure system thermal stability and bonding ability with 40μm BPP
5. New BH design for stable force control and consistent ultrasonic power
6. Magazine and track auto adjust function, fast leadframe switching(optional)
7. New generation moving magnet linear motor, no cooling air needed, saving more than 70% compressed air
8. Post bond inspection, 2 points PR, VLL function to improve UPH, bond quality monitoring, and 2nd bond stability of high density bonding
9. Compatible with SECS/GEM, https link